Posts Tagged ‘reverse engineering schematic from circuit card’
PCB Reverse Engineering Primary Objective
PCB Reverse Engineering primary objective is the development of unrestricted technical data, adequate for competitive procurement, through engineering evaluations of existing hardware.
In Process Reviews (IPRs) should be performed at the end of each principal phase of the PCB card cloning process to assure compliance to the process and to evaluate the need for continuing reverse engineering on the item.
a. Functional/economic analysis should be completed to collect available documentation, determine missing data requirements, determine testing requirements, and develop the PCB board Reverse Engineering Cost-Estimates and Schedules;
b. A disassembly procedure should be completed for each candidate to ensure functional integrity is maintained to allow for a viable analysis and documentation;
c. A reverse engineering management plan should be completed for each candidate to ensure a logical sequence of events to prevent delays or misinterpretations in the overall program objectives;
d. A hardware analysis should be performed to develop the missing data required for Level 3 drawings by restoring schematic diagram of circuit board;
e. Level 3 drawings are the result of the reverse engineering process and contain the documented parameters necessary to reproduce the selected candidate;
f. A quality control study should be performed and documented on the Level 3 drawings and prototypes of candidates to certify their compliance with original candidate specifications;
g. A production review should be performed to determine the economics of production of the reverse engineered item;
h. Prototype production involves the manufacture and testing of prototypes to determine if they meet all required specifications; and
i. A finalized TDP should be formulated and delivered to the Government/Tasking Agency requesting the reverse engineering of the candidate item.
Article quote from MLK-HDBK-115A(ARMY)