Reverse DSP CPLD IC Chip Program from memory, and copy memory content to new CPLD chip which will provide the same functions as original DSP chip by Crack CPLD protection.
Reverse DSP CPLD IC Chip Program from memory, and copy memory content to new CPLD chip which will provide the same functions as original DSP chip by Crack CPLD protection
Layout reconstruction requires the images of all the layers inside the chip to be combined. The images are normally taken automatically using a motorised stage to move the sample and special software to combine all the images together.
Normally, for semiconductor chips fabricated with 0.13 µm or smaller technology, images are created using a SEM which has a resolution better than 10 nm.