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With all the features the External Memory Interface provides, it is well suited to operate as an interface to memory devices such as External SRAM and Flash, and peripherals such as LCD-display, A/D, and D/A. The main features are:

Four different wait-state settings (including no wait-state).

Independent wait-state setting for different extErnal Memory sectors (configurable sector size).

The number of bits dedicated to address high byte is selectable.

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When the eXternal MEMory (XMEM) is enabled, address space outside the internal SRAM becomes available using the dedicated External Memory pins (see Figure 2 on page 3, Table 36 on page 88, Table 42 on page 92, and Table 54 on page 102). The memory configuration is shown in Figure 14.

The interface consists of: AD7:0: Multiplexed low-order address bus and data bus.

A15:8: High-order address bus (configurable number of bits).

ALE: Address latch enable.

RD: Read strobe.

WR: Write strobe.

The control bits for the External Memory Interface are located in two registers, the External Memory Control Register A – XMCRA, and the External Memory Control Register B– XMCRB.

When the XMEM interface is enabled, the XMEM interface will override the setting in the data direction registers that corresponds to the ports dedicated to the XMEM interface.

For details about the port override, see the alternate functions in section “I/O-Ports” on page 81. The XMEM interface will auto-detect whether an access is internal or external if reverse engineering microcontroller atmega1281 program.

If the access is external, the XMEM interface will output address, data, and the control signals on the ports according to Figure 16 (this figure shows the wave forms without wait-states). When ALE goes from high-to-low, there is a valid address on AD7:0. ALE is low during a data transfer.

When the XMEM interface is enabled, also an internal access will cause activity on address, data and ALE ports, but the RD and WR strobes will not toggle during internal access. When the External Memory Interface is disabled, the normal pin and data direction settings are used.

Note that when the XMEM interface is disabled, the address space above the internal SRAM boundary is not mapped into the internal SRAM. Figure 15 illustrates how to connect an external SRAM to the AVR using an octal latch (typically “74 x 573” or equivalent) which is transparent when G is high.

Due to the high-speed operation of the XRAM interface, the address latch must be selected with care for system frequencies above 8 MHz @ 4V and 4 MHz @ 2.7V.

When operating at conditions above these frequencies, the typical old style 74HC series latch becomes inadequate. The External Memory Interface is designed in compliance to the 74AHC series latch. However, most latches can be used as long they comply with the main timing parameters. The main parameters for the address latch are:

D to Q propagation delay (tPD).

Data setup time before G low (tSU).

Data (address) hold time after G low (TH).

The External Memory Interface is designed to guaranty minimum address hold time after G is asserted low of th = 5 ns. Refer to tLAXX_LD/tLLAXX_ST in “External Data Memory Timing” Tables 169 through Tables 176 on pages 376 – 378.

The D-to-Q propagation delay (tPD) must be taken into consideration when calculating the access time requirement of the external component. The data setup time before G low (tSU) must not exceed address valid to ALE low (tAVLLC) minus PCB wiring delay (dependent on the capacitive load).

The pull-ups on the AD7:0 ports may be activated if the corresponding Port register is written to one. To reduce power consumption in sleep mode, it is recommended to disable the pull-ups by writing the Port register to zero before entering sleep.

The XMEM interface also provides a bus-keeper on the AD7:0 lines. The bus-keeper can be disabled and enabled in software as described in “External Memory Control Register B – XMCRB” on page 35. When enabled, the bus-keeper will keep the previous value on the AD7:0 bus while these lines are tri-stated by the XMEM interface.

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The EEPROM Read Enable Signal EERE is the read strobe to the EEPROM. When the correct address is set up in the EEAR Register, the EERE bit must be written to a logic one to trigger the EEPROM read. The EEPROM read access takes one instruction, and the requested data is available immediately.

When the EEPROM is read, the CPU is halted for four cycles before the next instruction is executed. The user should poll the EEPE bit before starting the read operation. If a write operation is in progress, it is neither possible to read the EEPROM, nor to change the EEAR Register if Reverse engineering microcontroller attiny85 flash.

The calibrated Oscillator is used to time the EEPROM accesses. Table 3 lists the typical programming time for EEPROM access from the CPU. The following code examples show one assembly and one C function for writing to the EEPROM. The examples assume that interrupts are controlled (e.g. by disabling interrupts globally) so that no interrupts will occur during execution of these functions.

The examples also assume that no Flash Boot Loader is present in the software. If such code is present, the EEPROM write function must also wait for any ongoing SPM command to finish. The next code examples show assembly and C functions for reading the EEPROM after break MCU attiny2313 code.

The examples assume that interrupts are controlled so that no interrupts will occur during execution of these functions. During periods of low VCC, the EEPROM data can be corrupted because the supply voltage is too low for the CPU and the EEPROM to operate properly.

These issues are the  same as for board level systems using EEPROM, and the same design solutions should be applied. An EEPROM data corruption can be caused by two situations when the voltage is too low. First, a regular write sequence to the EEPROM requires a minimum voltage to operate correctly when Reverse engineering microcontroller attiny4313 code.

Secondly, the CPU itself can execute instructions incorrectly, if the supply voltage is too low. EEPROM data corruption can easily be avoided by following this design recommendation:

Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This can be done by enabling the internal Brown-out Detector (BOD). If the detection level of the internal BOD does not match the needed detection level, an external low VCC reset Protection circuit can be used.

If a reset occurs while a write operation is in progress, the write operation will be completed provided that the power supply voltage is sufficient.

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The external Resistor-Capacitor (RC) modes support the use of an external RC circuit. This allows the designer maximum flexibility in frequency choice while keeping costs to a minimum when clock accuracy is not required. There are two modes: RC and RCIO.

In RC mode, the RC circuit connects to OSC1. OSC2/CLKOUT outputs the RC oscillator frequency divided by 4. This signal may be used to provide a clock for external circuitry, synchronization, calibration, test or other application requirements. Figure 4-5 shows the external RC mode connections after  recover pic16f873 IC.

The INTOSC and INTOSCIO modes configure the internal oscillators as the system clock source when (SCS) bit of the OSCCON register. user-adjusted via software using the OSCTUNE register (Register 4-2).

2. The LFINTOSC (Low-Frequency Internal Oscillator) is uncalibrated and operates at 31 kHz. The system clock speed can be selected via software.

INTERNAL CLOCK MODEL

The Oscillator module has two independent, internal oscillators that can be configured or selected as the system clock source.

1. The HFINTOSC (High-Frequency Internal Oscillator) is factory calibrated and operates at 8 MHz. The frequency of the HFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 4-2) for the purpose of recover microcontroller tms320f2812pgfa firmware.

2. The LFINTOSC (Low-Frequency Internal Oscillator) is uncalibrated and operates at 31 kHz. The system clock speed can be selected via software using the Internal Oscillator Frequency Select bits IRCF<2:0> of the OSCCON register. an>

The INTOSC and INTOSCIO modes configure the internal oscillators as the system clock source when bit of the OSCCON register. See Section 4.6  user-adjusted via software using the OSCTUNE register (Register 4-2).

2. The LFINTOSC (Low-Frequency Internal Oscillator) is uncalibrated and operates at 31 kHz. The system clock speed can be selected via software.

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DEVICE OVERVIEW

The PIC16F91X/946 devices are covered by this datasheet. They are available in 28/40/44/64-pin packages. Figure 1-1 shows a block diagram of the PIC16F913/916 device, Figure 1-2 shows a block diagram of the PIC16F914/917 device, and Figure 1-3 shows a block diagram of the PIC16F946 device. Table 1-1 shows the pinout descriptions.

MEMORY ORGANIZATION

The PIC16F91X/946 has a 13-bit program counter capable of addressing a 4K x 14 program memory space for the PIC16F913/914 (0000h-0FFFh) and an 8K x 14 program memory space for the PIC16F916/917 and PIC16F946 (0000h-1FFFh). Accessing a location above the memory boundaries for the PIC16F913 and PIC16F914 will cause a wrap around within the first 4K x 14 space. The Reset vector is at 0000h and the interrupt vector is at 0004h after attack microcontroller pic18f66k90 heximal.

DATA MEMORY ORGANIZATION

The data memory is partitioned into multiple banks which contain the General Purpose Registers (GPRs) and the Special Function Registers (SFRs). Bits RP0 and RP1 are bank select bits.

Bank 0 is selected

Bank 1 is selected

Bank 2 is selected

Bank 3 is selected

Each bank extends up to 7Fh (128 bytes). The lower locations of each bank are reserved for the Special Function Registers. Above the Special Function Registers are the General Purpose Registers, implemented as static RAM. All implemented banks contain Special Function Registers. Some frequently used Special Function Registers from one bank are mirrored in another bank for code reduction and quicker access.

2.2.1

GENERAL PURPOSE REGISTER

The register file is organized as 256 x 8 bits in the PIC16F913/914, 352 x 8 bits in the PIC16F916/917 and 336 x 8 bits in the PIC16F946. Each register is accessed either directly or indirectly through the File Select for the purpose of Copy MCU pic18f458 binary

Register (FSR) (see Section 2.5 “Indirect Addressing, INDF and FSR Registers”).

SPECIAL FUNCTION REGISTERS

The Special Function Registers are registers used by the CPU and peripheral functions for controlling the desired operation of the device (see Tables 2-1, 2-2, 2-3 and 2-4). These registers are static RAM.

The Special Function Registers can be classified into two sets: core and peripheral. The Special Function Registers associated with the “core” are described in this section. Those related to the operation of the peripheral features are described in the section of that peripheral feature.

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The ATMEGA461A is a complex microcontroller with more peripheral units than can be supported within the 64 location reserved in the Opcode for the IN and OUT instructions.

For the Extended I/O space from $060 – $1FF in SRAM, only the ST/STS/STD and LD/LDS/LDD instructions can be used. The first 4,608/8,704 Data Memory locations address both the Register File, the I/O Memory, Extended I/O Memory, and the internal data SRAM if Break microcontroller attiny48v firmware.

The first 32 locations address the Register file, the next 64 location the standard I/O Memory, then 416 locations of Extended I/O memory and the next 8,192 locations address the internal data SRAM.

An  optional  external  data  SRAM  can  be  used  with  the ATmega461. This SRAM will occupy an area in the remaining address locations in the 64K address space. This area starts at the address following the internal SRAM after Break IC ATtiny48A software.

The Register file, I/O, Extended I/O and Internal SRAM occupies the lowest 4,608/8,704 bytes, so when using 64KB (65,536 bytes) of External Memory, 60,478/56,832 Bytes of External Memory are available. See “External Memory Interface” on page 29 for details on how to take advantage of the external memory map.

When the addresses accessing the SRAM memory space exceeds the internal data memory locations, the external data SRAM is accessed using the same instructions as for the internal data memory access. When the internal data memories are accessed, the break and write strobe pins (PG0 and PG1) are inactive during the whole access cycle.

External SRAM operation is enabled by setting the SRE bit in the XMCRA Register. Accessing external SRAM takes one additional clock cycle per byte compared to access of the internal SRAM when recover chip atmega261a program.

This means that the commands LD, ST, LDS, STS, LDD, STD, PUSH, and POP take one additional clock cycle. If the Stack is placed in external SRAM, interrupts, subroutine calls and returns take three clock cycles extra because the three-byte program counter is pushed and popped, and external memory access does not take advantage of the internal pipe-line memory access.

When external SRAM interface is used with wait-state, one-byte external access takes two, three, or four additional clock cycles for one, two, and three wait-states respectively. Interrupts, subroutine calls and returns will need five, seven, or nine clock cycles more than specified in the instruction set manual for one, two, and three wait-states.

The five different addressing modes for the data memory cover: Direct, Indirect with Displacement, Indirect, Indirect with Pre-decrement, and Indirect with Post-increment. In the Register file, registers R26 to R31 feature the indirect addressing pointer registers.

The direct addressing reaches the entire data space. The Indirect with Displacement mode reaches 63 address locations from the base address given by the Y- or Z-register.

When using register indirect addressing modes with automatic pre-decrement and post increment, the address registers X, Y, and Z are decremented or incremented.

The 32 general purpose working registers, 64 I/O registers, and the 4,196/8,192 bytes of internal data SRAM in the ATmega640/1280/1281/2560/2561 are all accessible through all these addressing modes. The Register File is described in “General Purpose Register File” on page 12.

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Low-Power Features:

· Standby Current:

– <100 nA @ 2.0V, typical

· Operating Current:

– 11 ìA @ 32 kHz, 2.0V, typical

– 220 ìA @ 4 MHz, 2.0V, typical

· Watchdog Timer Current:

– 1 ìA @ 2.0V, typical

Peripheral Features:

· Liquid Crystal Display module:

– Up to 60/96/168 pixel drive capability on 28/40/64-pin devices, respectively

– Four commons

· Up to 24/35/53 I/O pins and 1 input-only pin:

– High-current source/sink for direct LED drive

– Interrupt-on-change pin

– Individually programmable weak pull-ups

· In-Circuit Serial Programming™ (ICSP™) via two pins

· Analog comparator module with:

– Two analog comparators

– Programmable on-chip voltage reference (CVREF) module (% of VDD) for the purpose of copying microcontroller pic16f747 code

– Comparator inputs and outputs externally accessible

· A/D Converter:

– 10-bit resolution and up to 8 channels

· Timer0: 8-bit timer/counter with 8-bit programmable prescaler

· Enhanced Timer1:

– 16-bit timer/counter with prescaler

– External Timer1 Gate (count enable)

– Option to use OSC1 and OSC2 as Timer1 oscillator if INTOSCIO or LP mode is selected

· Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler

· Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART)

· Up to 2 Capture, Compare, PWM modules:

– 16-bit Capture, max. resolution 12.5 ns

– 16-bit Compare, max. resolution 200 ns

– 10-bit PWM, max. frequency 20 kHz

· Synchronous Serial Port (SSP) with I2C™

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High-Performance RISC CPU:

· Only 35 Instructions to Learn:

– All single-cycle instructions except branches

· Operating Speed:

– DC – 20 MHz oscillator/clock input

– DC – 200 ns instruction cycle

· Interrupt Capability

· 8-Level Seep Hardware Stack

· Direct, Indirect and Relative Addressing modes

Special Microcontroller Features:

· Precision Internal Oscillator:

– Factory calibrated to ±1%

– Software selectable frequency range of 8 MHz to 32 kHz

– Software tunable

– Two-Speed Start-up mode

– Crystal fail detect for critical applications

– Clock mode switching during operation for power savings after recover mcu p89lpc925fdh hex

· Power-Saving Sleep mode

· Wide Operating Voltage Range (2.0V-5.5V)

· Industrial and Extended Temperature Range

· Power-on Reset (POR)

· Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)

· Brown-out Reset (BOR) with Software Control Option

· Enhanced Low-Current Watchdog Timer (WDT) with on-chip Oscillator (software selectable nominal 268 seconds with full prescaler) with Software Enable

· Multiplexed Master Clear with Pull-up/Input Pin if break chip

· Programmable Code Protection

· High-Endurance Flash/EEPROM cell:

– 100,000 write Flash endurance

– 1,000,000 write EEPROM endurance

– Flash/Data EEPROM retention: > 40 years

Low-Power Features:

· Standby Current:

– 30 nA @ 2.0V, typical

· Operating Current:

– 8.5 ìA @ 32 kHz, 2.0V, typical

– 100 ìA @ 1 MHz, 2.0V, typical

· Watchdog Timer Current:

– 1 ìA @ 2.0V, typical

· Timer1 Oscillator Current:

– 2 ìA @ 32 kHz, 2.0V, typical

Peripheral Features:

· High-Speed Comparator module with:

– Two independent analog comparators

– Programmable on-chip voltage reference (CVREF) module (% of VDD) when break microcontroller pic12f629 program

– 1.2V band gap voltage reference

– Comparator inputs and outputs externally accessible

– < 40 ns propagation delay

– 2 mv offset, typical

· Operational Amplifier module with 2 independent Op Amps:

– 3 MHz GBWP, typical

– All I/O pins externally accessible

· Two-Phase Asynchronous Feedback PWM module:

– Complementary output with programmable dead band delay

– Infinite resolution analog duty cycle

– Sync Output/Input for multi-phase PWM

– FOSC/2 maximum PWM frequency

· A/D Converter:

– 10-bit resolution and 14 channels (2 internal)

· 17 I/O pins and 1 Input-only Pin:

– High-current source/sink for direct LED drive

– Interrupt-on-pin change

– Individually programmable weak pull-ups

· Timer0: 8-Bit Timer/Counter with 8-Bit Programmable Prescaler

· Enhanced Timer1:

– 16-bit timer/counter with prescaler

– External Gate Input mode

– Option to use OSC1 and OSC2 in LP mode as Timer1 oscillator, if INTOSC mode selected

· Timer2: 8-Bit Timer/Counter with 8-Bit Period Register, Prescaler and Postscaler for the purpose of break chip

· Capture, Compare, PWM module:

– 16-bit Capture, max resolution 12.5 ns

– Compare, max resolution 200 ns

– 10-bit PWM with 1 output channel, max frequency 20 kHz

· In-Circuit Serial ProgrammingTM (ICSPTM) via two pins

· Shunt Voltage Regulator (PIC16HV785 only):

– 5 volt regulation

– 4 mA to 50 mA shunt range

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Status Register:

The Status register contains the arithmetic status of the ALU, the Reset status and the bank select bits for data memory

The Status register can be the destination for any instruction, as with any other register. If the Status register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic.

Furthermore, the TO and PD bits are not writable, therefore, the result of an instruction with the Status register as destination may be different than intended.

For example, CLRF STATUS, will clear the upper three bits and set the Z bit. This leaves the Status register as 000u u1uu (where u = unchanged).

It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the Status register because these instructions do not affect the Z, C or DC bits from the Status register. For other instructions not affecting any Status bits e, the result of an instruction with the Status register as destination may be different than intended after Copy Chip pic16f886 firmware.

The Program Counter (PC) is 13 bits wide. The low byte comes from the PCL register which is a readable and writable register. The upper bits (PC<12:8>) are not readable but are indirectly writable through the PCLATH register. On any Reset, the upper bits of the PC will be cleared. Figure 2-4 shows the two situations for the loading of the PC. The upper example in the figure shows how the PC is loaded on a write to PCL (PCLATH<4:0> → PCH). The lower example in the figure shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3> → PCH) for the purpose of Copy mcu at89c55wd bin.

The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on).

PIC16F7X7 devices are capable of addressing a con- been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). tinuous 8K word block of program memory. The CALL and GOTO instructions provide only 11 bits of address to allow branching within any 2K program memory page.

When doing a CALL or GOTO instruction, the upper 2 bits of the address are provided by PCLATH<4:3>.

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MEMORY ORGANIZATION

There are two memory blocks in each of these PICmicro® MCUs. The program memory and data memory have separate buses so that concurrent access can occur and is detailed in this section. The program memory can be read internally by user code (see Section 3.0 “Reading Program Memory”) when copy P87C51X2BBD microcontroller.

Additional information on device memory may be found in the “PICmicro® Mid-Range MCU Family Reference Manual” (DS33023).

The PIC16F767 devices have a 13-bit program counter capable of addressing an 8K word x 14-bit program memory space. The PIC16F767 devices have 8K words of Flash program memory and the PIC16F767 devices have 4K words. The program memory maps for PIC16F7X7 devices are shown in Figure 2-1. Accessing a location above the physically implemented address will cause a wraparound. in the “PICmicro® Mid-Range MCU Family Reference.

The Reset vector is at 0000h and the interrupt vector is at 0004h.

The data memory is partitioned into multiple banks which contain the General Purpose Registers and the Special Function Registers. Bits RP1 (Status<6>) and RP0 (Status<5>) are the bank select bits if copy recover 430G2452 microcontroller:

Each bank extends up to 7Fh (128 bytes). The lower locations of each bank are reserved for the Special Function Registers. Above the Special Function Registers are General Purpose Registers, implemented as static RAM. All implemented banks contain Special Function Registers. Some frequently used Special Function Registers from one bank may be mirrored in another bank for code reduction and quicker access.

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Special Microcontroller Features:

· Fail-Safe Clock Monitor for protecting critical applications against crystal failure;

· Two-Speed Start-up mode for immediate code execution

· Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)

· Programmable Code Protection

· Processor Read Access to Program Memory

· Power-Saving Sleep mode

· In-Circuit Serial Programming (ICSP) via two pins

· MPLAB® In-Circuit Debug (ICD) via two pins

· MCLR pin function replaceable with input only pin if Copy chip pic16f870 program

DEVICE OVERVIEW

This document contains device specific information about the following devices:

PIC16F737/767 devices are available only in 28-pin packages, while PIC16F747/777 devices are available in 40-pin and 44-pin packages. All devices in the PIC16F7X7 family share common architecture with the following differences:

· The PIC16F737 and PIC16F767 have one-half of the total on-chip memory of the PIC16F747 and PIC16F777.

· The 28-pin devices have 3 I/O ports, while the 40/44-pin devices have 5.

· The 28-pin devices have 16 interrupts, while the 40/44-pin devices have 17.

· The 28-pin devices have 11 A/D input channels, while the 40/44-pin devices have 14.

· The Parallel Slave Port is implemented only on the 40/44-pin devices.

· Low-Power modes: RC_RUN allows the core and peripherals to be clocked from the INTRC, while SEC_RUN allows the core and peripherals to be clocked from the low-power Timer1. Refer to

Section 4.7 “Power-Managed Modes” for further details for the purpose of break pic18f8722 Microcontroller code.

· Internal RC oscillator with eight selectable frequencies, including 31.25 kHz, 125 kHz, 250 kHz, 500 kHz, 1 MHz, 2 MHz, 4 MHz and 8 MHz. The INTRC can be configured as a primary or secondary clock source. Refer to Section 4.5 “Internal Oscillator Block” for further details.