Break IC, Recover MCU, Microcontroller Reverse Engineering

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Texas Instruments MSP430G2213 Microcontroller Memory Reverse Engineering technique will help to locate the security fuse bit of mcu msp430g2213 and crack it by focus ion beam, and then extract embedded heximal program out from msp430g2213 mcu;

 

RAM

 

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER	TEST CONDITIONS	MIN      MAX	UNIT
V(RAMh)                 RAM retention supply voltage (1)	CPU halted	1.6	V

(1) This parameter defines the minimum supply voltage V_CC when the data in RAM remains unchanged which can be used for restoring msp430g2001 heximal program. No program execution should happen during this supply voltage condition.

JTAG and Spy-Bi-Wire Interface

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER	TEST CONDITIONS	VCC	MIN	TYP	MAX	UNIT
fSBW	Spy-Bi-Wire input frequency			2.2 V	0		20	MHz
tSBW,Low	Spy-Bi-Wire low clock pulse duration			2.2 V	0.025                       15	µs
tSBW,En	Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge	(1))		2.2 V	1	µs
tSBW,Ret	Spy-Bi-Wire return to normal operation time			2.2 V	15		100	µs
fTCK	TCK input frequency(2)			2.2 V	0		5	MHz
RInternal	Internal pulldown resistance on TEST			2.2 V	25	60	90	kΩ

Altera PLD EPM7128ALC84 IC Breaking involve the unlocking of epm7128 eeprom memory tamper resistance system and extract embedded jed software from pld eeprom memory;

MAX 7000S devices

– ISP circuitry compatible with IEEE Std. 1532

Includes 5.0-V MAX 7000 devices and 5.0-V ISP-based MAX 7000S devices

Built-in JTAG boundary-scan test (BST) circuitry in MAX 7000S devices with 128 or more macrocells

Complete EPLD family with logic densities ranging from 600 to 5,000 usable gates (see Tables 1 and 2) 5-ns pin-to-pin logic delays with up to 175.4-MHz counter frequencies (including interconnect)

PCI-compliant devices available

Open-drain output option in MAX 7000S devices

Programmable macrocell flipflops with individual clear, preset, clock, and clock enable controls

Programmable power-saving mode for a reduction of over 50% in each macrocell

Configurable expander product-term distribution, allowing up to 32 product terms per macrocell 44 to 208 pins available in plastic J-lead chip carrier (PLCC), ceramic pin-grid array (PGA), plastic quad flat pack (PQFP), power quad flat pack (RQFP), and 1.0-mm thin quad flat pack (TQFP) packages Programmable security bit for protection of proprietary designs 3.3-V or 5.0-V operation.

– MultiVoltTM I/O interface operation, allowing devices to interface with 3.3-V or 5.0-V devices (MultiVolt I/O operation is not available in 44-pin packages)

– Pin compatible with low-voltage MAX 7000A and MAX 7000B devices

Enhanced features available in MAX 7000E and MAX 7000S devices

– Six pin- or logic-driven output enable signals

– Two global clock signals with optional inversion

– Enhanced interconnect resources for improved routability

– Fast input setup times provided by a dedicated path from I/O pin to macrocell registers

– Programmable output slew-rate control

Software design support and automatic place-and-route provided by Altera’s development system for Windows-based PCs and Sun SPARCstation, and HP 9000 Series 700/800 workstations Additional design entry and simulation support provided by EDIF 2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM) when attacking cpld altera epm7064stc eeprom memory,

Verilog HDL, VHDL, and other interfaces to popular EDA tools from manufacturers such as Cadence, Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, and VeriBest

Programming support

– Altera’s Master Programming Unit (MPU) and programming hardware from third-party manufacturers program all MAX 7000 devices

– The BitBlasterTM serial download cable, ByteBlasterMVTM parallel port download cable, and MasterBlasterTM serial/universal serial bus (USB) download cable program MAX 7000S devices

Attack Altera CPLD EPM7064STC44-10 IC Eeprom Memory needs to crack altera cpld epm7064 fuse bit and extract embedded jed file from eeprom memory;

MAX 7000A devices provide an optional open-drain (equivalent to open-collector) output for each I/O pin. This open-drain output enables the device to provide system-level control signals to recovering cpld epm7032vtc eeprom code (e.g., interrupt and write enable signals) that can be asserted by any of several devices. This output can also provide an additional wired-OR plane.

Open-drain output pins on MAX 7000A devices (with a pull-up resistor to the 5.0-V supply) can drive 5.0-V CMOS input pins that require a high VIH. When the open-drain pin is active, it will drive low. When the pin is inactive, the resistor will pull up the trace to 5.0 V to meet CMOS VOH requirements.

The open-drain pin will only drive low or tri-state; it will never drive high. The rise time is dependent on the value of the pull-up resistor and load impedance by reversing cpld epm7032aeti44 eeprom jed file. The IOL current specification should be considered when selecting a pull-up resistor.

Altera CPLD EPM7064AETC100 Chip Protection Breaking needs to unlock epm7064aetc100 security fuse bit by focus ion beam and then copy embedded firmware from eeprom memory of cpld chip;

Bus-friendly architecture, including programmable slew-rate control

Open-drain output option

Programmable macrocell registers with individual clear, preset, clock, and clock enable controls

Programmable power-up states for macrocell registers in MAX 7000AE devices

Programmable power-saving mode for 50% or greater power reduction in each macrocell

Configurable expander product-term distribution, allowing up to 32 product terms per macrocell

Programmable security bit for protection of proprietary designs 6 to 10 pin- or logic-driven output enable signals

Two global clock signals with optional inversion

Enhanced interconnect resources for improved routability

Fast input setup times provided by a dedicated path from I/O pin to macrocell registers

Programmable output slew-rate control from Crack PLD IC Altera EPM7064AETC100-4N

Programmable ground pins

Software design support and automatic place-and-route provided by Altera’s development systems for Windows-based PCs and Sun SPARCstation, and HP 9000 Series 700/800 workstations Additional design entry and simulation support provided by EDIF 2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM), Verilog HDL, VHDL, and other interfaces to popular EDA tools from manufacturers such as Cadence, Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity, and VeriBest.

Programming support with Altera’s Master Programming Unit (MPU), MasterBlasterTM serial/universal serial bus (USB) communications cable, ByteBlasterMVTM parallel port download cable, and BitBlasterTM serial download cable, as well as programming hardware from third-party manufacturers and any JamTM STAPL File (.jam), Jam Byte-Code File (.jbc), or Serial Vector Format File (.svf) capable in-circuit tester when recover altera cpld epm7064aetc100 software.

Reverse Engineering INTEL CPLD EPM7032AELC44-10N Chipset can help engineer learn the internal structure of CPLD and unlock cpld epm7032 cpld through locating the fuse bit and disable it by focus ion beam, then the embedded jed file will be extracted from its eeprom directly;

 

High-performance 3.3-V EEPROM-based programmable logic devices (PLDs) built on second-generation Multiple Array MatriX (MAX®) architecture (see Table 1)

• 3.3-V in-system programmability (ISP) through the built-in IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface with advanced pin-locking capability to reverse cpld epm7032aeti44 jed file
  • MAX 7000AE device in-system programmability (ISP) circuitry compliant with IEEE Std. 1532
  • EPM7128A and EPM7256A device ISP circuitry compatible with IEEE Std. 1532
• Built-in boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1
• Supports JEDEC Jam Standard Test and Programming Language (STAPL) JESD-71
• Enhanced ISP features
  • Enhanced ISP algorithm for faster programming (excluding EPM7128A and EPM7256A devices)
  • ISP_Done bit to ensure complete programming (excluding EPM7128A and EPM7256A devices)

• • Pull-up resistor on I/O pins during in-system programming
• Pin-compatible with the popular 5.0-V MAX 7000S devices
• High-density PLDs ranging from 600 to 10,000 usable gates
• Extended temperature range

Reverse CPLD IC EPM7032AETI44-7 Eeprom JED File starts from unlocking the security fuse bit of cpld epm7032aeti44 chip, the embedded jed file will be extracted from cpld chip;

Each LAB has 16 shareable expanders that can be viewed as a pool of uncommitted single product terms (one from each macrocell) with inverted outputs that feed back into the logic array.

Each shareable expander can be used and shared by any or all macrocells in the LAB to build complex logic functions when reading cpld dump information. A small delay (tSEXP) is incurred when shareable expanders are used. Figure 3 shows how shareable expanders can feed multiple macrocells.

Parallel expanders are unused product terms that can be allocated to a neighboring macrocell to implement fast, complex logic functions.

Parallel expanders allow up to 20 product terms to directly feed the macrocell OR logic, with five product terms provided by the macrocell and 15 parallel expanders provided by neighboring macrocells in the LAB.

The compiler can allocate up to three sets of up to five parallel expanders to the macrocells that require additional product terms when attacking cpld encrypted code. Each set of five parallel expanders incurs a small, incremental timing delay (tPEXP).

For example, if a macrocell requires 14 product terms, the compiler uses the five dedicated product terms within the macrocell and allocates two sets of parallel expanders; the first set includes five product terms, and the second set includes four product terms, increasing the total delay by 2 ´ tPEXP.

Texas Instrument MSP430G2121 Processor’s CPU memory Reverse Engineering is a process to unlock msp430g2121 microcontroller flash memory and readout embedded firmware from microcontroller;

To improve EMI on the XT1 oscillator the following guidelines should be observed:

Keep the trace between the device and the crystal as short as possible.

Design a good ground plane around the oscillator pins.

Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT to replicate mcu msp430g2152 flash memory data.

Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.

Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.

If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.

Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This signal is no longer required for the serial programming adapter.

Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal by attacking msp430g2312 microcontroller protective flash memory.

Requires external capacitors at both terminals. Values are specified by crystal manufacturers.

Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX specifications might set the flag.

Measured with logic-level input frequency, but also applies to operation with crystals.

Reverse Engineering Texas Instrument Microcontroller MSP430G2444 structure and locate the security fuse bit of MCU, unlock the protection over msp430g2444 flash memory and then extract TI MSP430G2444 flash program out from its memory;

To improve EMI on the XT1 oscillator, the following guidelines should be observed.

Keep the trace between the device and the crystal as short as possible.

Design a good ground plane around the oscillator pins to attack mcu msp430g2452 cpu flash memory protection.

Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.

Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.

Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.

If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.

Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This signal is no longer required for the serial programming adapter when restoring mcu msp430g2452 flash memory binary.

Includes parasitic bond and package capacitance (approximately 2 pF per pin).

Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the crystal that is used.

Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX specifications might set the flag.

Measured with logic-level input frequency but also applies to operation with crystals.

Attack Texas Instrument MSP430G2544 CPU Flash Memory can help engineer to extract embedded firmware from microcontroller msp430g2544 flash memory and then duplicate the binary to new MCU msp430g2544;

Typical applications include sensor systems that capture analog signals, convert them to digital values,  and then process the data for display or for transmission to a host system. Stand-alone radio-frequency (RF) sensor front ends are another area of application.

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied to carry out the attacking over mcu msp430g2312 protective flash memory code ,Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

All voltages referenced to V_SS.

The JTAG fuse-blow voltage, V_FB, is allowed to exceed the absolute maximum rating. The voltage is applied to the TEST pin when blowing the JTAG fuse.

Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.

Break Mixed Signal MSP430G2744 Flash Memory and write the flash memory program to new msp430g2744 microcontroller for cloning;

The Texas Instruments MSP430™ family of ultra-low-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with  five low-power modes, is optimized to achieve extended battery life in portable measurement applications.

The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from low-power modes to active mode in less than 1 µs.

The MSP430G2x44 series is an ultra-low-power mixed-signal microcontroller with two built-in 16-bit timers, a universal serial communication interface (USCI), 10-bit analog-to-digital converter (ADC) with integrated reference and data transfer controller (DTC), and 32 I/O pins which are critical features for locked microcontroller msp430g2452 flash memory breaking.