Attack Microchip MCU protective system and extract Embedded Firmware from microcontroller memory, make Microchip MCU cloning unit by provide the same functions as masters;
Attack Microchip MCU protective system and extract Embedded Firmware from memory, make Microchip MCU cloning unit by provide the same functions as masters;
The removal of material is strongly anisotropic (directional). Only the surfaces hit by the ions are removed, sides perpendicular to their paths are not touched. Mechanical polishing is performed with the use of abrasive materials. The process is time-consuming and requires special machines to maintain the planarity of the surface.
From the inspection perspective, the advantages of using polishing over wet and dry etching techniques is the ability to remove layer by layer and view features in the area of interest within the same plane. It is especially useful on multilayer interconnect processes fabricated with advanced planarisation techniques.